REQ-003 — PCB hotspot ≤ 50°C at full load
draft · Performance
Statement
The device shall not exceed 50°C (case / PCB hotspot) at full load and 25°C ambient.
Acceptance Criteria
Thermal measurement at VOUT=24V, ILOAD=600mA per channel (both channels active), 25°C ambient; no point on case or PCB exceeds 50°C after thermal soak (30 min minimum). Measure at L1, L2, U1, U3, L3, L4.
Sign-offs
No sign-offs recorded. Approving a requirement records one here.